Security of operatives and handling
- Exposure dosage less then 0,5 µS/h
- Semi 2/8 standard and more
- X-ray shielding box made in Japan
-
Flexible Handling
- Standard frame table (without Vacuum)
- Wafer table (Vacuum) + Wafer handler
- Strip table (Vacuum) + Strip handler
- Customized handling
Operational Panels
- Easy to use GUI
- Multi Languages
- Semi 2/8 standard and more
- Warpage solution by vacuum table
- Start system
- Emergency stop
- Open door safety
Main operation panel
- Main switch
- X-ray life counter
- Light for „system on“
- Emergency stop
- Open door safety
Wafer Table(with warpage correction) or Standard Table
- Vacuum technics
- Wafer Level Packages, including complex FOWLP etc.
- Chip Scale Packages and Flip Chips
- Micro bumps, including Non-Wets
- Filled, Buried and Blind Vias
- On Wafers, On Strips and On Individual Devices
Positioning and Magnification
- Ultra High Precision Manipulation, giving the best accuracy and repeatability in the market today.
- Repeatable Inspecting and Measuring of defect structures down to 300 nm
- Detects the positions to be measured automatically thanks to highest image recognition
Flat Panel Detector (6MP)
- Detects the positions to be measured automatically thanks to highest image recognition
- Calibration technique
- 2D automated analysis + AI technology
- 2D manual analysis
Laminography Trajectory
- Repeatable Inspecting and Measuring of defect structures down to 300 nm
- Detects the positions to be measured automatically thanks to highest image recognition
- 3D automated analysis
Inclined Detector (8MP)
- Repeatable Inspecting and Measuring of defect structures down to 300 nm
- Detects the positions to be measured automatically thanks to highest image recognition
- 3D automated analysis + AI technology
- 3D manual analysis
Source Head and Target technique
- Repeatable Inspecting and Measuring of defect structures down to 300 nm
- Target and Head cooling for focus stability
- Filament life time around 800 h
-
Target options
- High Power Target
- High Resolution High Power
X-ray source
- Voltage 130 kV
- Up to 64 Watts
- Up to 7 Watts Target power
- Up to 250 nm 2D resolution
-
Target options
- High Power Target
- High Resolution High Power
Standard and Specifications
- Safety standards: CE, SEMI, NFPA, FDA
- Weight 7,2 kg
- Air supply
- Rated power
- X-ray leakage less than 0.5 µSv/h
Service sliding doors
- Minimizing 0 down time
- Taiwan, China, Japan
- SMART connectivity allows supporting variations of connection types and completes traceabilty concepts
System Monitor + 2D measurement
- Simple and easy operation
- Fully automated wafer handling and testing process up to 450 mm wafers enables efficient manpower deployment
- Individually applicable: manual measurements are possible at any time
VGInline + 3D Measurment
- Simple and easy operation
- Fully automated wafer handling and testing process up to 300 mm wafers enables efficient manpower deployment
- Individually applicable: manual measurements are possible at any time