Security of operatives and handling

  • Exposure dosage less then 0,5 µS/h
  • Semi 2/8 standard and more
  • X-ray shielding box made in Japan
  • Flexible Handling
    • Standard frame table (without Vacuum)
    • Wafer table (Vacuum) + Wafer handler
    • Strip table (Vacuum) + Strip handler
    • Customized handling

Operational Panels

  • Easy to use GUI
  • Multi Languages
  • Semi 2/8 standard and more
  • Warpage solution by vacuum table
  • Start system
  • Emergency stop
  • Open door safety

Main operation panel

  • Main switch
  • X-ray life counter
  • Light for „system on“
  • Emergency stop
  • Open door safety

Wafer Table(with warpage correction) or Standard Table

  • Vacuum technics
  • Wafer Level Packages, including complex FOWLP etc.
  • Chip Scale Packages and Flip Chips
  • Micro bumps, including Non-Wets
  • Filled, Buried and Blind Vias
  • On Wafers, On Strips and On Individual Devices

Positioning and Magnification

  • Ultra High Precision Manipulation, giving the best accuracy and repeatability in the market today.
  • Repeatable Inspecting and Measuring of defect structures down to 300 nm
  • Detects the positions to be measured automatically thanks to highest image recognition

Flat Panel Detector (6MP)

  • Detects the positions to be measured automatically thanks to highest image recognition
  • Calibration technique
  • 2D automated analysis + AI technology
  • 2D manual analysis

Laminography Trajectory

  • Repeatable Inspecting and Measuring of defect structures down to 300 nm
  • Detects the positions to be measured automatically thanks to highest image recognition
  • 3D automated analysis

Inclined Detector (8MP)

  • Repeatable Inspecting and Measuring of defect structures down to 300 nm
  • Detects the positions to be measured automatically thanks to highest image recognition
  • 3D automated analysis + AI technology
  • 3D manual analysis

Source Head and Target technique

  • Repeatable Inspecting and Measuring of defect structures down to 300 nm
  • Target and Head cooling for focus stability
  • Filament life time around 800 h
  • Target options
    • High Power Target
    • High Resolution High Power

X-ray source

  • Voltage 130 kV
  • Up to 64 Watts
  • Up to 7 Watts Target power
  • Up to 250 nm 2D resolution
  • Target options
    • High Power Target
    • High Resolution High Power

Standard and Specifications

  • Safety standards: CE, SEMI, NFPA, FDA
  • Weight 7,2 kg
  • Air supply
  • Rated power
  • X-ray leakage less than 0.5 µSv/h

Service sliding doors

  • Minimizing 0 down time
  • Taiwan, China, Japan
  • SMART connectivity allows supporting variations of connection types and completes traceabilty concepts

System Monitor + 2D measurement

  • Simple and easy operation
  • Fully automated wafer handling and testing process up to 450 mm wafers enables efficient manpower deployment
  • Individually applicable: manual measurements are possible at any time

VGInline + 3D Measurment

  • Simple and easy operation
  • Fully automated wafer handling and testing process up to 300 mm wafers enables efficient manpower deployment
  • Individually applicable: manual measurements are possible at any time